tuning fork crystal units (cylinder type) ??wC ? storage temperature range ?? ?40~+85 motional capacitance ?B 0.0035pf typical lPdepend on the frequency temperature coefficient ??S [-0.0350.01]ppm/ operating temperature range ?? ?40~+85 series resistance C 30kohm max at 25 depend on the frequency turnover temperature c? 255 drive level ? 1.0w max frequency tolerance {l 20ppm at 25 need to specify frequency range l? 32.768khz need to specify load capacitance ?d 12.0pf need to specify rohs compliant standard TDXLF-308 features best suited for portable devices with low current consumption ?m????yO for a clock source in digital equipments m?aO r? standard specifications ?? 2 quality factor q ? 50000typical lPdepend on the frequency frequency vs. temperature curve insulation resistance ^ 500mohm min. shunt capacitance oB 1.75pf typical lPdepend on the frequency dc100v15v(pin to pin,pin to case) capacitance ratio c0/c1 500 typical lPdepend on the frequency aging[first year] ?? 5ppm max 25 3 outline dimensions 2 TDXLF-308 tuning fork crystal units
no. 1 2 3 times free drop from 75cm height to hard wooden 3 4 5 ?1reliability(mechanical and environmental endurance) test items test method and condition requirements (1) lvibration frequency 10 to 55hz l?:10ppm vibration (2) ?vibration amplitude 1.5mm frequency change:10ppm max. (3) cycle time 1-2min(10-55-10hz) ?:5kohm (4) ?direction x.y.z resistance change:5kohm max. (5) ?rgduration 2h/each direction n 75cm ????3 30mm ?? l?:10ppm shock frequency change:10ppm max. board of thickness more than 30mm ?:5kohm resistance change: 5kohm max. w??????0.5-0.6mpa 1 r; ?:1x108mbar.l/s leakage ??|Vz?xy? leakage:1x108mbar.l/s max. put crystal units into a hermetic container and helium for 0.5-0.6 mpa,and keep it for 1h;check the leakage by a helium leak detect o ? ???a3-5s a?245 5 ^e 95% ?oa solderability put the leads of crystal units into solder melted tank for 3 to 5s wthe dipped surface of the leads temperature of solder melted tank is 245 5 should be at least 95% covered with continuous new solder coating ? 350 10 ,3+1/-0 sec l?:10ppm soldering iron frequency change:10ppm max. resistance ?:10kohm resistance change: 10kohm max. 6 ? ???????? wave soldering the wave soldering profile as below is recommended: resistance TDXLF-308 tuning fork crystal units
no. test items test method and condition requirements 6 ( ?? 0.9kg(9n) mw 30s5s; o w ) the crystal lead is not abnormity lead strength(dip) 7 l? :10ppm frequency change:10ppm max. 8 ? 2reliability(mechanical and environmental endurance) 0.45kg 902 ( ? 1.5mm ? the crystal lead with the 0.9kg(9n)power(keep it for 30s5s) and bend the crystal lead 90 with 0.45kg power and two times which you want to bend should be more than 1.5mm from the case) ?? w 85 2 h 2 r?? 1-2 r high temperature the crystal units shall be put in somewhere for 2 hours at endurance temperature of 85 2 ,then keep it for 1 to 2 hours under room ? :5kohm temperature resistance change:5kohm max. ?? w -25 h 2 r?? 1-2 r low temperature the crystal units shall be put in somewhere for 2 hours at endurance temperature of -25 ,then keep it for 1 to 2 hours under room temperature ? w h r ? 9 10 ???? temperature cycle 11 }F? ?Q? l? :10ppm frequency change:10ppm max. ? w 40 90-95% h 48 r?? humidity endurance 1-2 r the crystal units shall be put in somewhere at 40 in relative humidity of 90-95% for 48 hours, then keep it for one or two hours under room temperature ?? -40 30 ? 100 30 -40 30 ??? 25 ??? ? 5 ?? temperature shift from low(-40 ) to high(100 ,keep 30 minutes),satisfy high(100 ) to low(-40 ,keep 30 minutes),then go up to room temperature for 5 cycles w}F 5%, ? 35 }F 96 r?? ^?? salt spray test the appearance shall has no abnormity put the crystal units in the salt spray room(salt density:5%)at the and soldering is good. temperature of 35 for 96 hours.then clean it with water and dry its surface. ? :5kohm resistance change:5kohm max. TDXLF-308 tuning fork crystal units
no. 1 ?r????M?_J 2 ?fprocessing instructions fY??_?????w?a?A??? ??wp?_?O?? the following instructions and information are provided for the purpose of having the user understand the proper way to process our crystal products to prevent problems prior to use and enhance the reliability of the equipment to which they are applied. processing instructions ??wwhen dropped by mistake O?u??wn, ???w????Cn???bg the crystal units are designed and manufactured to resist physical shocks.however,when the crystal units are subjected to excessive impact such as being dropped onto the floor or giving shocks during processing,need to make sure its satisfactory performance before using it. soldering (1) ?F?r? 4 ??F??? 350 lead wires should be soldered within 4 seconds with the soldering iron heated to a temperature no higher than 350 (2) ?ya??r?10 ??a???260 K???wa. ]?? ?b? ??w ?b? ??w in solder-dip processing,the leads should be soldered within 10 seconds with a temperature no higher than 260 .mounting in upright is recommendable to prevent the heat conduction directly to the body of the crystal unit. (3) ?????? the wave soldering profile as below is recommended for TDXLF-308 tuning fork crystal resonaters. TDXLF-308 tuning fork crystal units
no. 3 ]x3.0mm, K?bAM?_ 4 ?fprocessing instructions processing instructions ??w_to bend the lead of cylinder type products (1) A?w??_r??_r??w??_?w?x1.5mm when the lead of cylinder type crystal units need to be bent,leave more than 1.5mm 3.0mm is recommendable) of lead from the case in order to prevent from any cracks of the hermetic sealing glass at the root of the lead,and use a jig to bend if possible. (2) A?w?M?_r?xO when bending the lead of cylinder type crystal units,do not scrape off the soldering plating from the lead surface. ??bmounting (1) ????p?A?w???uM?]?z?YM ? soldering the body of the cylinder type crystal units with pcb must be avoided due to deteriorate the characteristics or damage the products.rubber adhesive is recommended rubber adhesive rubber adhesive 5 6 (2) ??r?when the lead needs to be bent by hand,please follow the instruction as below: ??Aw?; ?A????xw?1.5mm ?]3.0mm ; ?A?90 ???b?p?? hold the body of the cylinder type crystal unit in fingers; pick at the part with tweezer,which you want to bend.there should be more than 1.5mm(3.0mm is recommended) from the body case; bend the lead 90 by tweezer without pulling the lead strongly.if pulling the lead strongly may cause any cracks of hermetic sealing glass at the root of the lead and may cause the leakage and the characteristics to deteriorate. ??w??cleaning (1) ??????????p??w?w?M?????? ? _Jw??????p crystal units may be sffected and destroyed at worst by supersonic cleaning or supersonic welding.please be sure to check if your cleaning and welding process sffects any damage to crystal units before using. (2) ????w?p??????_J????m some kinds of cleaning fluid may cause any damage to crystal units.please be sure to check suitability of the cleaning fluid in advance. Astorage ??w?LrgA????h??l??????w?A???? h????YA6 ???b? storage of crystal units under higher temperature or high humidity for a long term may affects frequency stability or solderability. please store the crystal units under the normal temperature and humidity without exposing to direct sunlight and dew condensation and avoid the storage of crystal units for more than 6 months and mount them as soon as possible after unpacking rubber adhesive pcb rubber adhesive insulator 1.5mm , and avoid the storage of crystal units for more than 6 months , and mount them as soon as possible after unpacking . TDXLF-308 tuning fork crystal units
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